We provide the best products and solutions for customer needs as the goal. We mainly provide high-quality formula epoxy system, polyurethane, industrial release agent, wood can be processed, room temperature curing silica gel, color paste, high-pressure grouting process of microporous resin, fast mold and supporting equipment. Our rapid resin mold solutions are used in a wide range of mold and composite applications, including automotive, shipbuilding, aerospace, foundry mold production, and other industrial and prototype applications. JRJ formula epoxy resin system is developed with many years of market experience, which can meet the requirements of different process applications of epoxy resin system. According to customer needs to adjust the viscosity, gel time, curing process, heat resistance and specific properties: epoxy mold gel coat: (all gel coat system has good chemical resistance)
RG404
| Blue, high thixotropy. Wear and temperature resistance 80-100 ° C general-purpose mold gel coat |
RG406
|
Blue, low thixotropy. Grinding and dressing 80-100 ° C temperature resistance general medium and large resin mold |
RG515
| Gray (aluminum-filled) low thixotropy/abrasive dressing temperature resistant 110-120 ° c hot forming dies |
RG205
| Gray, low thixotropy. It can Polish heat-resistant 100-120 ° c hot forming and composite die |
| RG206 | Black, low thixotropy. It can Polish heat-resistant 100-120 ° c hot forming and Composite Die |
Epoxy mold backing material: (gel time/mixing viscosity can be adjusted)
RL528 | RH5040--100:40 light yellow/low viscosity system universal mold backing rh5411-100:25 light yellow/low viscosity system temperature resistance 80-100 ° CRH8011--100:25 transparent/low viscosity system rh8911-100:25 transparent/low viscosity system temperature resistance 80-100 ° C |
RL5310 RH5311 | 100:25 dark brown/low viscosity system low cost die backing |
EC705A EC705B
100:25 | Transparent/low viscosity system temperature resistant 100-120 ° C hot forming and composite die |
EC715A EC715B
100:11 | Gray aluminum filler system temperature resistance 100-120 ° C hot forming die back material such as foam mold/plastic mold |
LP351A LP351B
| The paste resin containing fiber is used for die structure strengthening
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Epoxy model paste
SW450 1：1
| Red-brown, density 0.5 hardness shore D55 large male mold application temperature resistance 70-80 ° C |
SW325 1：1 | Red-brown, 0.7 hardness shore D65 tooling model or gage temperature resistance 70-80 ° C |
SW395 2：1
| Beige, density 0.95 hardness shore D75 composite model application temperature resistance 100-110 ° C
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