Rapid manufacturing and rapid tooling solutions for semiconductor & industrial ceramic applications

The mold material and ceramic additives meet the production requirements for high-purity ceramics, ensuring no transfer of metal ions to the shaped body

Powder matching - slurry preparation - grouting test - adjustment of slurry formula - grouting forming -drying - firing - verification - mass production scheme design

Processable resin board-

development model

CNC tire mold

Quick tooling

Thermal insulation & heat-resistant tooling board

Semiconductor production-

Vacuum chuck & wire bonding

Wafer processing & IC assembly

Glass substrate air cushion conveying

Ceramic substrate & target material slip casting

(Alumina & quartz, etc.)

Perforated tooling board-

Ventilative & permeable

Conductive or insulating

Hydrophobic or hydrophilic

Characteristics of various materials

(Plastic & Metal & Non-metal)

Wet forming of industrial ceramics-

Pressure grouting & plastic compression forming

Breathable & Water-Permeable Porous Resin

Additives for precision ceramic applications

Pressure grouting equipment & mold

(Water-based or alcohol-based slurry system)

Unique microporous breathable and permeable product-

（Porous tooling resin and board）

 

We provide porous resin/processable boards and porous molds for various application fields.  

Create value for customers in industries such as thermoforming, vacuum forming, vacuum clamping, automotive, semiconductor, and ceramics.  

• Different types of fillers and particle sizes, such as aluminum, stainless steel, ceramic, or mineral fillers, are used in various applications

• Pore size, high mechanical strength, breathability, high-temperature stability, and other characteristics are important parameters to consider

• The material can be treated with hydrophilic or hydrophobic coatings to cater to various application scenarios

Porous product system：

Liquid epoxy porous resin system (non-metallic material)

After curing, the liquid casting tooling resin system exhibits different pore/pore size distributions on its surface and interior. The mold primarily utilizes the pore/pore size distribution formed on the surface after curing to meet our usage requirements. Therefore, the system cannot be processed by CNC after curing, but the surface can be slightly polished. It is suitable for batch ceramic pressure casting, rolling, and stamping process molds.

acrylic microporous resin system

Our acrylic microporous resin system exhibits identical properties in terms of surface and internal pore/pore size distribution after curing and molding. Therefore, it can be pre-cast and cured first, followed by CNC machining of the mold cavity, greatly enhancing mold manufacturing efficiency. (Surface casting or full casting)Suitable for molds used in batch ceramic pressure casting, rolling, and stamping processes.

The continuous negative pressure inside the microporous sheet generates a strong clamping force, even when the clamping surface is only partially covered. Our microporous sheets easily meet your highest expectations for surface smoothness and flatness. It can ensure very precise and accurate clamping of the test components. We can use our materials for optical quality inspection and measurement inspection. Our components are compatible with various measuring machines.

In the semiconductor industry, semiconductor clamping devices made of porous materials have the advantage of easy processing, smooth surfaces (with less friction), and uniform air distribution, making them very durable. Suitable for clean room conditions when using clean compressed air. The CE 100 WHITE chuck is widely used in the microelectronics industry for wafer processing, IC assembly, chip and wire bonding. The micro hole working disc produced by CE 100 WHITE slab is a special tool used for clamping and bearing in various semiconductor wafer production processes, suitable for thinning, cutting, grinding, cleaning, and processing

Materials are usually transported on drums or belts. The PT series porous sheet is a perfect solution for non-contact transportation of sensitive materials such as semiconductor chips, glass substrates, specialty foils, and flat panel displays through air cushions.