Rapid Manufacturing and Rapid Mold Solutions for Semiconductor&Industrial Ceramic Product Applications




Machinable resin board-

development model

CNC tire mold

Quick tooling

Thermal insulation and heat-resistant tooling board

(Long term temperature resistance up to 800 ℃)


Porous tooling board-

Breathable&Permeable

Conductive or insulating

Hydrophobic or hydrophilic

Various material characteristics

(Plastic&Metal&Non Metal)


Semiconductor production-

Vacuum suction cup&wire bonding

Wafer Processing&IC Assembly

Glass substrate air cushion conveying

Ceramic substrate&target material injection molding (alumina&quartz, etc.)

Wet forming of industrial ceramics-

Pressure grouting&solidification forming, etc

Breathable&Permeable Porous Resin

Elastic thermal conductive resin

Pressure grouting equipment&molds (meeting the high-purity requirements of industrial ceramics)

Precision ceramic application additives&spherical adjustment aids


Our microporous machinable mold sheet is a breathable microporous composite material sheet with excellent technical performance. Due to our unique process technology, we produce unique machinable microporous sheets. (Can be polished)

Unique microporous breathable products create value for customers in industries such as thermoforming, vacuum forming, vacuum clamping, automotive, semiconductor, ceramics, etc.

Our microporous breathable board has excellent processability. CNC machining can be used. Unlike sintered materials, the holes in the sheet will not be blocked during processing. The microporous characteristics of the board no longer require drilling. Its micro permeability replaces the molding/demolding exhaust holes required for traditional tools (molds used for deep drawing plastic films and sheets). The sheet can be easily bonded or combined with large and deep drawn molds or connected to aluminum frames. Multiple types of microporous sheets can be used to solve your challenges.

The continuous negative pressure inside the microporous sheet generates a strong clamping force, even when the clamping surface is only partially covered. Our microporous sheets easily meet your highest expectations for surface smoothness and flatness. It can ensure very precise and accurate clamping of the test components. We can use our materials for optical quality inspection and measurement inspection. Our components are compatible with various measuring machines.

In the semiconductor industry, semiconductor clamping devices made of porous materials have the advantage of easy processing, smooth surfaces (with less friction), and uniform air distribution, making them very durable. Suitable for clean room conditions when using clean compressed air. The CE 100 WHITE chuck is widely used in the microelectronics industry for wafer processing, IC assembly, chip and wire bonding. The micro hole working disc produced by CE 100 WHITE slab is a special tool used for clamping and bearing in various semiconductor wafer production processes, suitable for thinning, cutting, grinding, cleaning, and processing

Materials are usually transported on drums or belts. The PT series porous sheet is a perfect solution for non-contact transportation of sensitive materials such as semiconductor chips, glass substrates, specialty foils, and flat panel displays through air cushions.